High resolution gas gauge proximity sensor

ABSTRACT

In a gas gauge, effects due to changes in the local environment are reduced by causing a measurement nozzle and a reference nozzle to react as if they were co-located, or located at approximately the same position. This is achieved by venting the reference nozzle in very close proximity to the measurement nozzle. A reference chamber surrounding the reference plate and reference nozzle is vented at approximately the same location as the measurement nozzle. In an embodiment for use in a vacuum environment, the measurement nozzle is surrounded with an annular ring. The measurement annular ring is connected to an annular ring around the reference nozzle, which acts to co-locate the reference nozzle and the measurement nozzle. To avoid choked flow, another annular ring or rings may be placed around the measurement annular ring.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.10/833,249, filed Apr. 28, 2004, which is herein incorporated byreference in its entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates to the field of gas gauges for use in vacuum orambient environments.

2. Related Art

A typical air gauge is very sensitive to environmental effects, such asthe pressure, humidity, and temperature of the air. One method ofcanceling out these effects is to use a reference nozzle and ameasurement nozzle. The measurement nozzle uses air flow pressuredifferences to measure a distance between the nozzle and a surface. Forexample, the surface may be a semiconductor wafer or LCD panel. Thereference nozzle discharges air toward a reference plate. The surface ofthe reference plate is located at a pre-determined distance from thereference nozzle. The distance of the measurement nozzle to the surfacecan be determined by comparing the difference between the reference airflow pressure and the measurement airflow pressure.

If the properties of environmental effects are uniform over a largearea, or if the measurement is low-resolution so that minor fluctuationsin the environment do not affect the measurement, the same environmentshould exist at both the reference and measurement nozzles. Theseeffects can be canceled out relatively easily. However, this processbecomes ineffective when high-resolution measurements, such as those onthe order of nanometers, are required. When a small measurement isneeded, local environmental differences between the measurement nozzleand the reference nozzle significantly affect the measurements, evenwhen the nozzles are only a centimeter or two apart. If theenvironmental differences are variable and changing with time, avariable offset results that causes an unpredictable measurement error.

For example, if there is a net air flow from one nozzle to the other, apressure difference exists between the two. If that air flow changes,the pressure difference changes, resulting in an inaccurate measurement.

Measurement errors resulting from variable environments are notpredictable. This is important in many applications, such aslithography. In lithography, movement of a wafer stage to differentpositions dramatically affects the local air flow. Thus, offset causedby pressure differences is motion or velocity dependent rather thanfixed on the wafer. What is needed is a gauge that remains unaffected bychanges in the local environment.

SUMMARY OF THE INVENTION

The present invention reduces the problem of changes in the localenvironment by causing the measurement nozzle and the reference nozzleto react as if they were co-located, or located at approximately thesame position. This is achieved by venting the reference nozzle in veryclose proximity to the measurement nozzle.

In the present invention, a reference plate, located at a distance fromthe reference nozzle, acts to close in the reference nozzle and create areference chamber. The reference chamber is vented through a referencevent. The reference vent is located in approximately the same locationas the measurement nozzle. Because of the vent, any environmentalchanges, such as pressure, outside the vent will affect the referencenozzle. Since the vent is located at approximately the same position asthe measurement nozzle, environmental changes outside the vent willaffect the measurement nozzle and the reference nozzle in substantiallythe same way. In this manner, the reference nozzle and the measurementnozzle react to local environmental effects as if they are co-located.

The present invention may also be used where the ambient environment isa vacuum. In a vacuum, gas exiting the measurement nozzle may bestripped away by the vacuum before accurate measurements can be made.Here, the measurement nozzle is surrounded with an annular ring. Thereference chamber also forms an annular ring around the referencenozzle. The annular ring around the reference nozzle is connected to theannular ring around the measurement nozzle. The reference annular ringand the measurement annular ring act to co-locate the reference nozzleand the measurement nozzle. To avoid choked flow, another annular ringmay be placed around the measurement annular ring. In this case, chokedflow conditions occur between the outer annular ring and the vacuum,away from where the measurements are taking place.

A series of annular rings may surround the measurement annular ring, sothat the pressure is stepped down in increments from the measurementpressure to the vacuum.

Gas inlets and outlets from the annular rings act to inject additionalgas as needed, or remove excess gas from the annular rings. Thisadditional gas could be injected or removed based on algorithms executedon a computer. The algorithm could be based on experimental orcomputational fluid dynamics models. The algorithms may use feedbackbased on internal gauge sensor feedback or additional sensors placed atvarious locations on the gauge structure. This system may operate in aclosed loop feedback system.

Further embodiments, features, and advantages of the present invention,as well as the structure and operation of the various embodiments of thepresent invention, are described in detail below with reference to theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS/FIGURES

The accompanying drawings, which are incorporated herein and form a partof the specification, illustrate the present invention and, togetherwith the description, further serve to explain the principles of theinvention and to enable a person skilled in the pertinent art to makeand use the invention.

FIG. 1A is a 3-D view of an air gauge according to an embodiment of thepresent invention, showing a reference nozzle and a measurement nozzle.

FIG. 1B is a 3-D view of an air gauge according to an embodiment of thepresent invention, showing placement of the reference plate.

FIG. 2 is a side view of an air gauge according to an embodiment of thepresent invention.

FIG. 3 is a block diagram of an air gauge according to an embodiment ofthe present invention.

FIG. 4 is a diagram of flats of proximity for use in an air gaugeaccording to an embodiment of the present invention.

FIG. 5 is a graph showing the effect of blower noise on a conventionalair gauge.

FIG. 6 is a flowchart of a method according to an embodiment of thepresent invention.

FIG. 7 is a block diagram of a conventional air gauge.

FIG. 8 is a side view of a conventional air gauge.

FIG. 9A illustrates the effect of air flow on a conventional air gauge.

FIG. 9B illustrates the effect of blower noise on a conventional airgauge.

The present invention will be described with reference to theaccompanying drawings. The drawing in which an element first appears istypically indicated by the leftmost digit(s) in the correspondingreference number.

DETAILED DESCRIPTION OF THE INVENTION

While specific configurations and arrangements are discussed, it shouldbe understood that this is done for illustrative purposes only. A personskilled in the pertinent art will recognize that other configurationsand arrangements can be used without departing from the spirit and scopeof the present invention. It will be apparent to a person skilled in thepertinent art that this invention can also be employed in a variety ofother applications.

Introduction

In order to understand the benefits of the present invention, it ishelpful to describe a generic system, such as that found in U.S. Pat.No. 4,953,388 issued to Barada and U.S. Pat. No. 4,550,592 issued toDechape, each of which is incorporated herein by reference in itsentirety. FIG. 7 is a block diagram of a conventional air gauge 700. Anair pump 702 supplies air to a mass flow controller 704. Mass flowcontroller 704 maintains a constant rate of air flow into air gauge 700.The air then passes through filter 706 which removes impurities from theair. After leaving filter 706, the air is divided into two channels.Channel 708 is a measurement channel, which ultimately leads tomeasurement nozzle 710. Channel 712 is a reference channel, whichultimately leads to reference nozzle 714. To ensure a common flow rateto measurement nozzle 710 and reference nozzle 714, flow restrictors 716and 718 are placed in measurement channel 708 and reference channel 712,respectively. Flow restrictors 716 and 718 also have the effect ofdamping out upstream pressure and flow oscillations or disturbances.

Measurement channel 708 and reference channel 712 are connected viadifferential flow channel 720. Differential flow channel 720 includes amass air flow sensor 722. If the pressure at measurement nozzle 710 issubstantially equal to the pressure at reference nozzle 714, there is noflow across mass air flow sensor 722. However, if the distance betweenmeasurement nozzle 710 and, for example, a wafer 724 changes relative tothe distance between reference nozzle 714 and reference plate 726, thepressure at the measurement nozzle will also change. This pressuredifferential creates a movement of air from, for example, referencechannel 712 to measurement channel 708, through differential flowchannel 720. This movement of air is detected by mass air flow sensor722. Once detected, the distance between measurement nozzle 710 andwafer 724 can be measured.

An alternative configuration 800 is illustrated in FIG. 8. Air entersthrough flow restrictors 806 and 808. Measurement nozzle 802 andreference nozzle 804 are connected via differential flow channel 810having a mass flow sensor 812. Reference plate 814 and reference nozzle804 create a reference gap 816.

Non-Vacuum Environment

As mentioned above, the problem with conventional air gauges is thatthey typically are not capable of accounting for local environmentalchanges on a miniscule scale. FIGS. 9A and 9B illustrate how local noisecreated by the air gauge itself can adversely affect a measurement. InFIG. 9A, air can enter gauge 800 closer to one nozzle than the other.For example, external air flow 902 enters gauge 800 closer tomeasurement nozzle 802 than reference nozzle 804. This causes a steadypressure differential between nozzles 802 and 804, which will appear asa measurement offset.

The distance between measurement nozzle 802 and reference nozzle 804also allows the gauge to be adversely affected by noise, such as blowernoise 908, shown in FIG. 9B. Since blower noise 908 impacts measurementnozzle 802 and reference nozzle 804 out of phase, a high frequencypressure differential results. This pressure differential will appear asmeasurement noise.

Therefore, when trying to minimize environmental differences between thereference nozzle and the measurement nozzle, it is desirable for thereference nozzle and measurement nozzle to be as close together aspossible. However, structural limitations often prohibit the nozzlesfrom being as close as is necessary. The present invention overcomesthis limitation by treating the reference nozzle and the measurementnozzle as if they are co-located (located in approximately the sameplace). This is achieved by venting the reference nozzle in very closeproximity to the measurement nozzle.

FIGS. 1A and 1B are broad illustrations of the co-location conceptaccording to the present invention. As shown in FIG. 1A, referencenozzle 102 of gauge 100 is located near measurement nozzle 104. Eventhough reference nozzle 102 is fairly close to measurement nozzle 104,local environmental differences may exist between the two nozzles. FIG.1B illustrates how a reference plate 106 creates a reference chamber 108(shown in broken lines) around reference nozzle 102. Reference chamber108 is vented at reference vent 110. Reference vent 110 opens atapproximately the same location as measurement nozzle 104. Sincereference plate 106 inhibits air flow within reference chamber 108, thepressure within reference chamber 108 is substantially identical to thepressure at measurement nozzle 104. Likewise, the pressure at referencenozzle 102 is also substantially identical to the pressure atmeasurement nozzle 104. In this manner, reference nozzle 102 andmeasurement nozzle 104 react as though they are co-located. This reducesand/or eliminates the measurement offset and noise caused by externalair flow and pressure changes.

FIG. 2 further illustrates the concept of co-location. Gas enters gasgauge 200 at inlet 202. The gas is split into reference channel 204 andmeasurement channel 206 via flow restrictors 208 and 210, respectively.Gas is directed from measurement nozzle 216 toward a surface 222.Surface 222 may be, for example, a semiconductor wafer or LCD panel.Measurement nozzle 216 may include a nozzle-shaped tool. In anotherembodiment, measurement nozzle 216 is simply an opening at the end ofmeasurement channel 206.

Gas is also directed from reference nozzle 214 toward a reference plate218. In one embodiment, reference nozzle 214 includes a nozzle-shapedtool. In another embodiment, reference nozzle 214 is simply an openingat the end of reference channel 204.

Mass flow sensor 212 measures the gas flow between reference channel 204and measurement channel 206. Although in the present invention,reference nozzle 214 is physically separate from measurement nozzle 216,reference plate 218 is extended so as to provide a vent to thesurroundings at reference vent 220.

Vent 220 is close to measurement nozzle 216. This forms a referencechamber 224. Because the openings to measurement nozzle 216 andreference nozzle 214 (through reference chamber 224) are co-located,environmental effects at measurement nozzle 216 affect reference nozzle214 simultaneously. For example, if blower noise or external air flowspast measurement nozzle 216, reference nozzle 214 is affected as well.Since each nozzle is affected in a substantially identical manner,changes in the ambient temperature or pressure can be cancelled out.

Vacuum Environment

FIG. 3 is a side view of an embodiment of the present invention that maybe used in a vacuum environment. Although gauge 300, shown in FIG. 3,will be described with reference to a vacuum, one of skill in the artwill recognize that gauge 300 may also be used in a non-vacuumenvironment.

A reference gap, or optimal distance, is shown as reference gap 302.Reference gap 302 is vented into an annular ring 304 surroundingreference nozzle 306. This forms a reference chamber. Although theannular rings will be referred to as such in the present example, aperson skilled in the relevant art will recognize that an annular ringmay simply be an annular volume. Annular ring 304 is connected toannular ring 308 via balance tube 320. Annular ring 308 surroundsmeasurement nozzle 310 and forms a measurement chamber. The volume ofthe reference chamber is substantially equal to the volume of themeasurement chamber. Since the measurement chamber (annular ring 308)surrounds measurement nozzle 310, the pressure in the measurementchamber is approximately equal to the pressure at the measurementnozzle. Balance tube 320 maintains approximately equal pressure in thereference chamber and the measurement chamber. Thus, measurement nozzle310 and reference nozzle 306 are subject to the same environmentalpressure, and react as though they are co-located.

If a gas gauge is used in a vacuum environment, there is a significantpressure difference between the environment and the gas being blown out.The large pressure difference between the gas input and the vacuumcreates a high-velocity flow and a condition called “choked flow.”Choked flow occurs when the upstream flow rate cannot be increased by areduction of downstream pressure because the flow rate is at itsmaximum. In other words, flow at the exit plane has reached a Machnumber of unity, the maximum for isotropic flow. If this condition isreached, it will adversely affect the measurement precision atmeasurement nozzle 310. This is because information about conditions inthe exhaust flow cannot be transmitted upstream. Therefore, measurementnozzle pressure or flow rates are not affected by further change such asvolume increase due to measurement gap increase or decrease. Valuableinformation is thereby lost, since the sensor is trying to determinemeasurement gap increase or decrease. The present invention corrects forchoked flow by placing another annular ring 312 around measurementnozzle 310, effectively moving the choked flow transition away from themeasurement and reference nozzles. This allows a stable measurementchamber at a higher pressure than the ambient environment. For example,the pressure within annular rings 308 and 312 may be 1 psi, with avacuum surrounding. Because of the additional annular ring 312, chokedflow only occurs between annular ring 312 and vacuum 314, away frommeasurement nozzle 310.

Additional gas may be supplied to annular rings 308 and 312 through gasinlets 316 and 318, respectively. One reason for injecting gas into theannular rings is that some gas may leak into vacuum 314. Injecting gasthrough gas inlets 316 and 318 keeps the pressure within gauge 300 highenough for accurate measurements. Conversely, inlets 316 and 318 can beused as outlets for venting excess gas. For example, if a measurementpressure of 1 psi is desired, but the outer annular ring is stepped downto a pressure of 0.5 psi, gas may be vented from annular ring 312through inlet 318.

A plurality of annular rings may be substituted for annular ring 312.This allows the pressure to drop in increments from measurement annularring 308 to vacuum 314. Thus, the pressure can still be controlled whilemeasurement nozzle 310 is further buffered from any choked flow. Thisalso allows the measurement nozzle to be buffered from the resultingpressure shockwaves that occur in the exit stream as Mach flow isreached or the flow is choked, since flow cannot expand isentropically.

One or more of sensors 324, 326, and 328 may be included in gauge 300.Sensors 324, 326, and 328 may be flow sensors. Alternatively, they maybe pressure sensors. One of skill in the art will recognize that anycombination of pressure and flow sensors may be used. In addition, oneof skill in the art will recognize that sensors similar to sensors 324,326, and 328 may be used in other locations of gauge 300 as needed.

FIG. 4 is an illustration of the annular rings according to anembodiment of the present invention. Measurement nozzle 310 is shown inthe center of FIG. 4. Annular ring 308 surrounds measurement nozzle 310.Annular ring 312 surrounds annular ring 308. The shaded areas in FIG. 4represent flats of proximity 402, 404, and 406. These are areas of, forexample, gauge 300 that are very close to the measured surface 322. Itis this proximity to surface 322 that gives rise to choked flowconditions between the annular rings and vacuum 314. Sensors 324 and 328for measuring the flow and/or pressure between the annular rings arealso shown.

It may be undesirable for gas from gauge 300 to be vented into vacuum314. Thus, gas may be removed at annular ring 312 to keep the gas fromleaking. Alternatively, if a specific gas does not affect the propertiesof the vacuum, that specific gas may be used throughout gauge 300 tominimize contamination due to leaks. In one embodiment, nitrogen is usedas the measurement gas. In another embodiment, argon is the measurementgas. In yet another embodiment, the measurement gas is a combination ofgases.

FIG. 5 is a graph depicting the effect of blower noise on a typical airgauge, such as that described with respect to FIG. 7. FIG. 5 includesresults from two measurement channels, AG1 and AG2. When the air bloweris turned off, as shown in area 502, the two measurement channels can beeasily measured. As shown, an offset exists between times when theblower is on and times when the blower is off. This offset is caused bya blower-induced pressure difference between the measurement nozzle andthe reference nozzle. Further, when the air blower is turned on, asshown in areas 504 and 506, so much noise is added to the system that anaccurate measurement cannot be made.

FIG. 6 is a flowchart of a method 600 for measuring distance to asurface according to the present invention. Although method 600 will bedescribed herein with reference to the structure of FIG. 2, one of skillin the art will recognize that method 600 may be used with any gaugeimplementing the present invention, such as that described in FIG. 3.

In step 602, gas is directed from an opening in a measurement channel toa surface. For example, gas may be directed from measurement nozzle 216,which is an opening in measurement channel 206, toward surface 222.

In step 604, gas is directed from an opening in a reference channel to areference plate. For example, gas may be directed from reference nozzle214, which is an opening in reference channel 204, toward referenceplate 218.

In step 606, the gas from the reference channel is vented to a vent thatis approximately co-located with the opening in the measurement channel.For example, gas from reference channel 204 may be vented throughreference chamber 224 having vent 220. Because of the proximity of vent220 to measurement nozzle 216, any environmental changes at measurementnozzle 216 emanate through reference chamber 224. Thus reference nozzle214 reacts as though it is co-located with measurement nozzle 216.

In step 608, the mass gas flow between the reference channel and themeasurement channel is measured. For example, mass gas flow sensor 212measures the flow between reference channel 204 and measurement channel206. This measurement is indicative of a pressure differential betweenreference channel 204 and measurement channel 206.

In step 609, gas may be added or removed based on additional pressure orflow sensors as well as computation algorithms. The additional pressureor flow sensors may be similar to sensors 324, 326, and 328 shown inFIG. 3. The computational algorithms may be based on the additionalsensors and/or an internal air gauge sensor feedback mechanism. Thecomputational algorithms could also be based on experimental results orfluid dynamics theory such as Fanno or Raleigh lines, where choked flowconditions and transitions are attempted to be controlled, much like insupersonic nozzle design. The implementation of these algorithms mayresult in a closed loop feedback pressure system. The closed loopfeedback pressure system may interact with the gas gauge measurementitself. Higher level algorithms may process this information, resultingin the final gauge feedback.

In step 610, a distance between the measurement channel, such asmeasurement channel 206, and the surface, such as surface 222, isdetermined. This difference is based on the pressure differential andthe distance from the reference channel, such as reference channel 204,to the reference plate, such as reference plate 218. If the distancebetween the measurement nozzle and the surface is the same as thedistance between the reference nozzle and the reference plate, gasdirected from the measurement nozzle will hit the surface at the samepressure that gas from the reference nozzle will hit the referenceplate. However, if the measurement distance is not substantially equalto the reference distance, gas from the measurement nozzle will not hitthe surface at the same pressure as gas from the reference nozzle hitsthe reference plate. The resulting pressure differential will bedetected by the mass flow sensor. Thus, using the pressure differentialand the reference distance, the measurement distance can be determined.

CONCLUSION

While various embodiments of the present invention have been describedabove, it should be understood that they have been presented by way ofexample only, and not limitation. It will be apparent to persons skilledin the relevant art that various changes in form and detail can be madetherein without departing from the spirit and scope of the invention.Thus, the breadth and scope of the present invention should not belimited by any of the above-described exemplary embodiments, but shouldbe defined only in accordance with the following claims and theirequivalents.

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 14. A method for measuringdistance to a surface, comprising: (a) directing gas from a measurementnozzle located in a measurement channel to said surface, (b) directinggas from a reference nozzle located in a reference channel to areference surface; (c) venting said reference nozzle at a positionco-located to said measurement nozzle, such that ambient pressure atsaid reference nozzle is approximately equal to ambient pressure at saidmeasurement nozzle; (d) determining a pressure differential between themeasurement channel and the reference channel; and (e) determining adistance between the measurement nozzle and the surface based on thepressure differential and the fixed distance.
 15. The method of claim 14further comprising directing additional gas or removing gas using asensor based on computation algorithms to control choked flow conditionsor transitions.
 16. The method of claim 14 further comprising removingchoked flow conditions between said measurement nozzle and a referencevolume.
 17. The method of claim 14, wherein said reference surfacecomprises a reference plate and is located at a fixed distance from saidreference nozzle.
 18. The method of claim 14, wherein said gas is argonor nitrogen.
 19. A method for measuring distance to a surface within avacuum, comprising: (a) directing gas from a measurement nozzle locatedin a measurement channel to said surface; (b) directing gas from areference nozzle located in a reference channel to a reference surface;(c) venting said reference nozzle at a position co-located to saidmeasurement nozzle, such that ambient pressure at said reference nozzleis approximately equal to ambient pressure at said measurement nozzle;(d) injecting or venting gas into one or more annular rings surroundingthe measurement and/or reference nozzles to provide an appropriate gaspressure level within the measurement and reference nozzles; (e)determining a pressure differential between the measurement channel andthe reference channel; and (f) determining a distance between themeasurement nozzle and the surface based on the pressure differentialand the fixed distance.
 20. The method of claim 19, wherein saidreference surface comprises a reference plate and is located at a fixeddistance from said reference nozzle.
 21. The method of claim 19, whereinsaid gas is argon or nitrogen.